| PART |
Description |
Maker |
| BM-20EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-A304ND |
hi-eff red chips, GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E524RD |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E324RD |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E544RE |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-C304ND |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-F304RD |
800mA Buck Converter for 3G RFPAs, WL-CSP-12, Tape & Reel
hi-eff red chips, which are made from GaAsP on GaP substrate.
|
Bright LED Electronics Corp.
|
| MSGB39WP |
HIGH EFF.RED/GREEN DUAL COLOR LAMP
|
MICRO-ELECTRONICS[Micro Electronics]
|
| BL-BEG271 |
LED Hi-Eff Red and Green Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-HE1W133-TRB |
Hi-Eff Red and Pure Green Suitable for all SMT assembly methods.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-HE1X133B-TRB |
Hi-Eff Red and Yellow Green Suitable for all SMT assembly methods.
|
Bright LED Electronics Corp.
|
